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18-bit, 1 MSPS PulSARTM ADC in MSOP/QFN
Preliminary Technical Data
18-bit resolution with no missing codes Throughput: 1MSPS Low Power dissipation: 7.5 mW @ 1MSPS, 75 W @ 10kSPS INL: 1 LSB typ, 2.5 LSB max Dynamic range: 99 dB True differential analog input range: VREF 0 V to VREF with VREF between 2.5V to 5.0V Any input range and easy to drive with the ADA4941 No pipeline delay Single-supply 2.5V operation with 1.8 V/2.5 V/3 V/5 V logic interface Serial interface SPI(R)/QSPITM/MICROWIRETM/DSP-compatible Daisy-chain multiple ADCs and BUSY indicator 10-lead package: MSOP (MSOP-8 size) and QFN (LFCSP), 3 mm x 3 mm same space as SOT-23
2.5 TO 5V 2.5V
AD7982
APPLICATION DIAGRAM EXAMPLE
IN+
REF VDD VIO SDI SCK SDO GND CNV
1.8 TO 5V 3- OR 4-WIRE INTERFACE (SPI, , CS DAISY CHAIN)
10V, 5V, .. ADA4941
AD7982
IN-
Figure 1.
GENERAL DESCRIPTION
The AD7982 is a 18-bit, successive approximation, analog-todigital converter (ADC) that operates from a single power supply, VDD. It contains a low power, high speed, 18-bit sampling ADC and a versatile serial interface port. On the CNV rising edge, it samples the voltage difference between IN+ and IN- pins. The voltages on these pins usually swing in opposite phase between 0 V and REF. The reference voltage, REF, is applied externally and can be set independently of the supply voltage, VDD. Its power scales linearly with throughput. The SPI-compatible serial interface also features the ability, using the SDI input, to daisy chain several ADCs on a single, 3-wire bus and provides an optional BUSY indicator. It is compatible with 1.8 V, 2.5 V, 3 V, or 5 V logic, using the separate supply VIO. The AD7982 is housed in a 10-lead MSOP or a 10-lead QFN (LFCSP) with operation specified from -40C to +85C.
APPLICATIONS
Battery-powered equipment Data acquisitions Instrumentation Medical instruments Seismic Data Acquisition Systems
Table 1. MSOP, QFN(LFCSP)/SOT-23 14, 16 and18-Bit ADC
100 kSPS Type 18Bit 16Bit AD7680 AD7683 AD7684 AD7940 250 kSPS AD76911 AD76851 AD76871 AD7694 AD79421 400500 kSPS AD76901 AD76861 AD76881 AD76931 AD79461 1000 kSPS AD79821 AD79801 ADC Driver ADA4941 ADA4841 ADA4941 ADA4841
14Bit
1
Pin-for-pin compatible.
Rev PrC
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AD7982 TABLE OF CONTENTS
Specifications..................................................................................... 3 Timing Specifications....................................................................... 5 Absolute Maximum Ratings............................................................ 6 ESD Caution.................................................................................. 6 Pin Configuration and Function Descriptions............................. 7 Terminology ...................................................................................... 8 Circuit Information.................................................................... 10 Converter Operation.................................................................. 10 Typical Connection Diagram ................................................... 11 Analog Input ............................................................................... 12 Driver Amplifier Choice............................................................ 12 Single-to-Differential Driver..................................................... 13 Single-to-Differential Driver..................................................... 13
Preliminary Technical Data
Voltage Reference Input ............................................................ 13 Power Supply............................................................................... 13 Digital Interface.......................................................................... 14 CS MODE 3-Wire, No BUSY Indicator .................................. 15 CS Mode 3-Wire with BUSY Indicator ................................... 16 CS Mode 4-Wire with BUSY Indicator ................................... 18 Chain Mode, No BUSY Indicator ............................................ 19 Chain Mode with BUSY Indicator........................................... 20 Application Hints ........................................................................... 21 Layout .......................................................................................... 21 Evaluating the AD7982's Performance.................................... 21 Outline Dimensions ....................................................................... 22
REVISION HISTORY
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Preliminary Technical Data SPECIFICATIONS
VDD = 2.5 V, VIO = 2.3 V to 5.5V, VREF = 5V, TA = -40C to +85C, unless otherwise noted. Table 2.
Parameter RESOLUTION ANALOG INPUT Voltage Range Absolute Input Voltage Analog Input CMRR Leakage Current at 25C Input Impedance ACCURACY No Missing Codes Differential Linearity Error Integral Linearity Error Transition Noise Gain Error2, TMIN to TMAX Gain Error Temperature Drift Zero Error2, TMIN to TMAX Zero Temperature Drift Power Supply Sensitivity THROUGHPUT Conversion Rate Transient Response AC ACCURACY Dynamic Range Spurious-Free Dynamic Range Total Harmonic Distortion Signal-to-(Noise + Distortion) Intermodulation Distortion4
1 2 3
AD7982
Conditions
Min 18 -VREF -0.1
Typ
Max
Unit Bits V V dB uA
IN+ - IN- IN+, IN- fIN = 1 MHz Acquisition phase
+VREF VREF + 0.1
66 150 See the Analog Input section 18 -1 -2.5
REF = 5 V
VDD = 2.5V 5% 0 Full-scale step VREF = 5 V fIN = 1 kHz fIN = 1 kHz fIN = 1 kHz, VREF = 5 V
0.5 1 1.05 2 1 1 1 0.1
+2 +2.5
Bits LSB1 LSB LSB LSB ppm/C mV ppm/C LSB MSPS ns dB3 dB dB dB dB
1 250 99 -120 -117 98 115
LSB means least significant bit. With the 5 V input range, one LSB is 38.15 V. See Terminology section. These specifications do include full temperature range variation but do not include the error contribution from the external reference. All specifications in dB are referred to a full-scale input FSR. Tested with an input signal at 0.5 dB below full-scale, unless otherwise specified. 4 fIN1 = 21.4 kHz, fIN2 = 18.9 kHz, each tone at -7 dB below full-scale.
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AD7982
VDD = 2.5 V, VIO = 2.3 V to 5.5V, VREF = 5V, TA = -40C to +85C, unless otherwise noted. Table 3.
Parameter REFERENCE Voltage Range Load Current SAMPLING DYNAMICS -3 dB Input Bandwidth Aperture Delay DIGITAL INPUTS Logic Levels VIL VIH IIL IIH DIGITAL OUTPUTS Data Format Pipeline Delay VOL VOH POWER SUPPLIES VDD VIO VIO Range Standby Current1, 2 Power Dissipation Energy per conversion TEMPERATURE RANGE3 Specified Performance
1 2
Preliminary Technical Data
Conditions
Min 2.4
Typ
Max 5.1
Unit V A MHz ns
1MSPS, REF = 5 V
500 10 2.5
VDD = 2.5 V
-0.3 0.7 x VIO -1 -1
0.3 x VIO VIO + 0.3 +1 +1
V V A A
ISINK= +500 A ISOURCE= -500 A
Serial 18 bits twos complement Conversion results available immediately after completed conversion 0.4 VIO - 0.3 2.37 2.3 1.8 2.5 2.63 5.5 5.5
V V V V V nA W mW nJ/sample C
Specified performance VDD and VIO = 2.5 V, 25C 10 kSPS throughput 1 MSPS throughput
1 75 7.5 7.5 -40 +85
TMIN to TMAX
With all digital inputs forced to VIO or GND as required. During acquisition phase. 3 Contact sales for extended temperature range.
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Preliminary Technical Data TIMING SPECIFICATIONS
-40C to +85C, VDD = 2.37 V to 2.63 V, VIO = 2.3 V to 5.5 V, unless otherwise stated. Table 4. 1
Parameter Conversion Time: CNV Rising Edge to Data Available Acquisition Time Time Between Conversions CNV Pulse Width ( CS Mode ) SCK Period ( CS Mode or Chain mode) VIO Above 4.5 V VIO Above 3 V VIO Above 2.7 V VIO Above 2.3 V VIO Above 1.7 V SCK Low Time SCK High Time SCK Falling Edge to Data Remains Valid SCK Falling Edge to Data Valid Delay VIO Above 4.5 V VIO Above 3 V VIO Above 2.7 V VIO Above 2.3 V VIO Above 1.7 V CNV or SDI Low to SDO D15 MSB Valid (CS Mode) VIO Above 3 V VIO Above 2.3 V CNV or SDI High or Last SCK Falling Edge to SDO High Impedance (CS Mode) SDI Valid Setup Time from CNV Rising Edge SDI Valid Hold Time from CNV Rising Edge SCK Valid Setup Time from CNV Rising Edge (Chain Mode) SCK Valid Hold Time from CNV Rising Edge (Chain Mode) SDI Valid Setup Time from SCK Falling Edge (Chain Mode) SDI Valid Hold Time from SCK Falling Edge (Chain Mode) SDI High to SDO High (Chain Mode with BUSY indicator)
1
AD7982
Symbol tCONV tACQ tCYC tCNVH tSCK
Min 350 250 1000 10 10 10.5 11.5 12.5 14.5 3 3 3
Typ
Max 750
tSCKL tSCKH tHSDO tDSDO
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
7.5 8 9 10 13 tEN 10 15 15 15 0 5 5 2.5 3 15
tDIS tSSDICNV tHSDICNV tSSCKCNV tHSCKCNV tSSDISCK tHSDISCK tDSDOSDI
See Figure 2 and Figure 3 for load conditions.
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AD7982 ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Analog Inputs IN+1, IN-1 to GND Supply Voltage REF, VIO to GND VDD to GND VDD to VIO Digital Inputs to GND Digital Outputs to GND Storage Temperature Range Junction Temperature JA Thermal Impedance JC Thermal Impedance Lead Temperature Range Vapor Phase (60 sec) Infrared (15 sec)
1
Preliminary Technical Data
Rating -0.3 V to VREF + 0.3 V or 130 mA -0.3 V to +6.0V -0.3 V to +3.0 V +3V to -6V -0.3 V to VIO + 0.3 V -0.3 V to VIO + 0.3 V -65C to +150C 150C 200C/W (MSOP-10) 44C/W (MSOP-10) 215C 220C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
See the Analog Input section.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
500A
IOL
TO SDO CL 20pF 500A IOH
1.4V
Figure 2. Load Circuit for Digital Interface Timing
70% VIO 30% VIO
tDELAY
2V OR VIO - 0.5V1 0.8V OR 0.5V2
tDELAY
2V OR VIO - 0.5V1 0.8V OR 0.5V2
02973-004
12V IF VIO ABOVE 2.5V, VIO - 0.5V IF VIO BELOW 2.5V. 20.8V IF VIO ABOVE 2.5V, 0.5V IF VIO BELOW 2.5V.
Figure 3. Voltage Levels for Timing
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02969-003
Preliminary Technical Data PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
REF 1 VDD 2 IN+ 3 IN- 4 GND 5
10 VIO
AD7982
REF 1 VDD 2 IN+ 3 IN- 4 GND 5
10 VIO
AD7982
TOP VIEW (Not to Scale)
9 8 7 6
SDI SCK SDO CNV
AD7982
TOP VIEW
9 8 7 6
SDI SCK SDO CNV
Figure 4. 10-Lead MSOP Pin Configuration
Figure 5. 10-Lead QFN (LFCSP) Pin Configuration
Table 6. Pin Function Descriptions
Pin No. 1 2 3 4 5 6 Mnemonic REF VDD IN+ IN- GND CNV Type1 AI P AI AI P DI Function Reference Input Voltage. The REF range is from 2.3 V to 5.5V. It is referred to the GND pin. This pin should be decoupled closely to the pin with a 10 F capacitor. Power Supply. Differential Positive Analog Input. Differential Negative Analog Input. Power Supply Ground. Convert Input. This input has multiple functions. On its leading edge, it initiates the conversions and selects the interface mode of the part, chain or CS mode. In CS mode, it enables the SDO pin when low. In chain mode, the data should be read when CNV is high. Serial Data Output. The conversion result is output on this pin. It is synchronized to SCK. Serial Data Clock Input. When the part is selected, the conversion result is shifted out by this clock. Serial Data Input. This input provides multiple features. It selects the interface mode of the ADC as follows: Chain mode is selected if SDI is low during the CNV rising edge. In this mode, SDI is used as a data input to daisy chain the conversion results of two or more ADCs onto a single SDO line. The digital data level on SDI is output on SDO with a delay of 18 SCK cycles. CS mode is selected if SDI is high during the CNV rising edge. In this mode, either SDI or CNV can enable the serial output signals when low, and if SDI or CNV is low when the conversion is complete, the BUSY indicator feature is enabled. Input/Output Interface Digital Power. Nominally at the same supply as the host interface (1.8 V, 2.5 V, 3 V, or 5 V).
7 8 9
SDO SCK SDI
DO DI DI
10
1
VIO
P
AI = Analog Input, DI = Digital Input, DO = Digital Output, and P = Power
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AD7982 TERMINOLOGY
Integral Nonlinearity Error (INL) It refers to the deviation of each individual code from a line drawn from negative full scale through positive full scale. The point used as negative full scale occurs 1/2 LSB before the first code transition. Positive full scale is defined as a level 11/2 LSB beyond the last code transition. The deviation is measured from the middle of each code to the true straight line (Figure 12). Differential Nonlinearity Error (DNL) In an ideal ADC, code transitions are 1 LSB apart. DNL is the maximum deviation from this ideal value. It is often specified in terms of resolution for which no missing codes are guaranteed. Zero Error The difference between the ideal midscale voltage, that is, 0 V, from the actual voltage producing the midscale output code, that is, 0 LSB. Gain Error The first transition (from 100 . . . 00 to 100 . . . 01) should occur at a level 1/2 LSB above nominal negative full scale (-4.999981 V for the 5 V range). The last transition (from 011...10 to 011...11) should occur for an analog voltage 11/2 LSB below the nominal full scale (+4.999943 V for the 5 V range.) The gain error is the deviation of the difference between the actual level of the last transition and the actual level of the first transition from the difference between the ideal levels. Spurious-Free Dynamic Range (SFDR) The difference, in decibels (dB), between the rms amplitude of the input signal and the peak spurious signal. Effective Number of Bits (ENOB) ENOB is a measurement of the resolution with a sine wave input. It is related to S/(N+D) by the following formula ENOB = (S/[N + D]dB - 1.76)/6.02 and is expressed in bits.
Preliminary Technical Data
Noise-free-code-resolution It is the number of bits beyond which it is impossible to distinctly resolve individual codes. It is calculated as : Noise-Free Code resolution = log2(2N/peak-to-peak noise) and is expressed in bits. Effective resolution It is calculated as : Effective resolution = log2(2N/rms input noise) and is expressed in bits. Total Harmonic Distortion (THD) THD is the ratio of the rms sum of the first five harmonic components to the rms value of a full-scale input signal and is expressed in dB. Dynamic Range It is the ratio of the rms value of the full scale to the total rms noise measured with the inputs shorted together. The value for dynamic range is expressed in dB. It is measured with a signal at -60dBFs to include all noise sources and DNL artifacts. Signal-to-Noise Ratio (SNR) SNR is the ratio of the rms value of the actual input signal to the rms sum of all other spectral components below the Nyquist frequency, excluding harmonics and dc. The value for SNR is expressed in dB. Signal-to-(Noise + Distortion) Ratio (S/[N+D]) S/(N+D) is the ratio of the rms value of the actual input signal to the rms sum of all other spectral components below the Nyquist frequency, including harmonics but excluding dc. The value for S/(N+D) is expressed in dB. Aperture Delay The measure of the acquisition performance and is the time between the rising edge of the CNV input and when the input signal is held for a conversion. Transient Response The time required for the ADC to accurately acquire its input after a full-scale step function was applied.
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Preliminary Technical Data TYPICAL PERFORMANCE CHARACTERISTICS: VDD=2.5V, VREF=5.0V, VIO=3.3V
AD7982
Figure 6. Integral Nonlinearity vs. Code
Figure 9. Differential Nonlinearity vs. Code
Figure 7. Histogram of a DC Input at the Code Center
0 -20
AMPLITUDE (dB of Full Scale)
f S = 1 MSPS f IN = 2kHz SNR = 96dB THD = -117dB SFDR = 120dB SINAD = 96dB
Figure 10. Histogram of a DC Input at the Code Transition
-40 -60 -80 -100 -120 -140 -160 -180 0 100 200 300
400
500
FREQUENCY (kHz)
Figure 8. FFT Plot
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AD7982
IN+
Preliminary Technical Data
SWITCHES CONTROL MSB 32,768C 16,384C REF COMP GND 32,768C 16,384C MSB 4C 2C C C LSB SW- CNV 4C 2C C C CONTROL LOGIC OUTPUT CODE LSB SW+ BUSY
IN-
Figure 11. ADC Simplified Schematic
CIRCUIT INFORMATION
The AD7982 is a fast, low power, single-supply, precise 18-bit ADC using a successive approximation architecture. The AD7982 is capable of converting 1,000,000 samples per second (1MSPS) and powers down between conversions. When operating at 10 kSPS, for example, it consumes 75 W typically, ideal for battery-powered applications. The AD7982 provides the user with an on-chip track-and-hold and does not exhibit any pipeline delay or latency, making it ideal for multiple multiplexed channel applications. The AD7982 can be interfaced to any 1.8 V to 5 V digital logic family. It is housed in a 10-lead MSOP or a tiny 10-lead QFN (LFCSP) that combines space savings and allows flexible configurations. It is pin-for-pin-compatible with the 16-bit AD7980.
CONVERTER OPERATION
The AD7982 is a successive approximation ADC based on a charge redistribution DAC. Figure 11 shows the simplified schematic of the ADC. The capacitive DAC consists of two identical arrays of 18 binary weighted capacitors, which are connected to the two comparator inputs. During the acquisition phase, terminals of the array tied to the comparator's input are connected to GND via SW+ and SW-. All independent switches are connected to the analog inputs. Thus, the capacitor arrays are used as sampling capacitors and acquire the analog signal on the IN+ and IN- inputs. When the acquisition phase is complete and the CNV input goes high, a conversion phase is initiated. When the conversion phase begins, SW+ and SW- are opened first. The two capacitor arrays are then disconnected from the inputs and connected to the GND input. Therefore, the differential voltage between the inputs IN+ and IN- captured at the end of the acquisition phase is applied to the comparator inputs, causing the comparator to become unbalanced. By switching each element of the capacitor array between GND and REF, the comparator input varies by binary weighted voltage steps (VREF/2, VREF/4 . . . VREF/262144). The control logic toggles these switches, starting with the MSB, in order to bring the comparator back into a balanced condition. After the completion of this process, the part returns to the acquisition phase and the control logic generates the ADC output code and a BUSY signal indicator. Because the AD7982 has an on-board conversion clock, the serial clock, SCK, is not required for the conversion process.
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Preliminary Technical Data
Transfer Functions
The ideal transfer characteristic for the AD7982 is shown in Figure 12 and Table 7.
AD7982
TYPICAL CONNECTION DIAGRAM
Figure 13 shows an example of the recommended connection diagram for the AD7982 when multiple supplies are available.
ADC CODE (TWOS COMPLEMENT)
011...111 011...110 011...101
100...010 100...001 100...000 -FS
-FS + 1 LSB
-FS + 0.5 LSB
ANALOG INPUT
Figure 12. ADC Ideal Transfer Function
Table 7. Output Codes and Ideal Input Voltages
Description FSR - 1 LSB Midscale + 1 LSB Midscale Midscale - 1 LSB -FSR + 1 LSB -FSR
1
Analog Input VREF = 5 V +4.999962 V +38.15 V 0V -38.15 V -4.999962 V -5 V
Digital Output Code Hexa 1FFFF1 00001 00000 3FFFF 20001 200002
This is also the code for an overranged analog input (VIN+ - VIN- above VREF - VGND). 2 This is also the code for an underranged analog input (VIN+ - VIN- below VGND).
V+
REF1 10F2 100nF
02973-024
+FS - 1 LSB +FS - 1.5 LSB
2.5V
V+ 100nF 20 0 TO VREF 2.7nF VV+
4
1.8V TO 5V
REF IN+
VDD
VIO SDI SCK SDO 3-WIRE INTERFACE
AD7982
IN- 20 GND
CNV
VREF TO 0 ADA4841-2 or note 3 2.7nF V4 1SEE REFERENCE SECTION FOR REFERENCE SELECTION. 2C REF IS USUALLY A 10F CERAMIC CAPACITOR (X5R). 3SEE DRIVER AMPLIFIER CHOICE SECTION. 4OPTIONAL FILTER. SEE ANALOG INPUT SECTION.
Figure 13. Typical Application Diagram with Multiple Supplies
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AD7982
ANALOG INPUT
Figure 14 shows an equivalent circuit of the input structure of the AD7982. The two diodes, D1 and D2, provide ESD protection for the analog inputs IN+ and IN-. Care must be taken to ensure that the analog input signal never exceeds the supply rails by more than 0.3 V because this causes these diodes to begin to forwardbias and start conducting current. These diodes can handle a forward-biased current of 130 mA maximum. For instance, these conditions could eventually occur when the input buffer's (U1) supplies are different from VDD. In such a case, an input buffer with a short-circuit, current limitation can be used to protect the part.
REF D1 CPIN GND CIN
Preliminary Technical Data
* The noise generated by the driver amplifier needs to be kept as low as possible in order to preserve the SNR and transition noise performance of the AD7982. The noise coming from the driver is filtered by the AD7982 analog input circuit 1-pole, low-pass filter made by RIN and CIN or by the external filter, if one is used. Because the typical noise of the AD7982 is 40 V rms, the SNR degradation due to the amplifier is
SNRLOSS
40 = 20log 2 2 40 + f - 3dB ( NeN ) 2

where:
RIN
IN+ OR IN-
D2
f-3dB is the input bandwidth in MHz of the AD7982 (10MHz) or the cutoff frequency of the input filter, if one is used. N is the noise gain of the amplifier (for example, +1 in buffer configuration).
Figure 14. Equivalent Analog Input Circuit
The analog input structure allows the sampling of the true differential signal between IN+ and IN-. By using these differential inputs, signals common to both inputs are rejected. During the acquisition phase, the impedance of the analog inputs (IN+ or IN-) can be modeled as a parallel combination of capacitor, CPIN, and the network formed by the series connection of RIN and CIN. CPIN is primarily the pin capacitance. RIN is typically 400 and is a lumped component made up of some serial resistors and the on resistance of the switches. CIN is typically 30 pF and is mainly the ADC sampling capacitor. During the conversion phase, where the switches are opened, the input impedance is limited to CPIN. RIN and CIN make a 1pole, low-pass filter that reduces undesirable aliasing effects and limits the noise. When the source impedance of the driving circuit is low, the AD7982 can be driven directly. Large source impedances significantly affect the ac performance, especially total harmonic distortion (THD). The dc performances are less sensitive to the input impedance. The maximum source impedance depends on the amount of THD that can be tolerated. The THD degrades as a function of the source impedance and the maximum input frequency.
eN is the equivalent input noise voltage of the op amp, in nV/Hz. * * For ac applications, the driver should have a THD performance commensurate with the AD7982. For multichannel multiplexed applications, the driver amplifier and the AD7982 analog input circuit must settle for a full-scale step onto the capacitor array at a 18-bit level (0.0004%, 4 ppm). In the amplifier's data sheet, settling at 0.1% to 0.01% is more commonly specified. This could differ significantly from the settling time at a 18-bit level and should be verified prior to driver selection.
Typical Application Very low noise, low power single to Differential Very low noise, small and low power Very low noise and high frequency Low noise and high frequency Low power, low noise, and low frequency 5 V single-supply, low noise 5 V single-supply, low power
Table 8. Recommended Driver Amplifiers
Amplifier ADA4941 ADA4841 AD8021 AD8022 OP184 AD8655 AD8605, AD8615
DRIVER AMPLIFIER CHOICE
Although the AD7982 is easy to drive, the driver amplifier needs to meet the following requirements:
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Preliminary Technical Data
SINGLE-TO-DIFFERENTIAL DRIVER
For applications using a single-ended analog signal, either bipolar or unipolar, the ADA4941 single-ended-to-differential driver allows for a differential input into the part. The schematic is shown in Figure 15. R1, R2 set the attenuation ratio between the input range and the ADC range (VREF). R1, R2 and CF shall be chosen depending on the desired input resistance, signal bandwidth, anti-aliasing and noise contribution. - e.g.: for +/-10V range with 4k impedance, R2=1k and R1= 4k R3, R4 and R5, R6 set the common mode on, respectively, the IN- and IN+ inputs of the ADC which should be close to VREF/2. - e.g.: for +/-10V range with single supply, R3=8.45k , R4= 11.8k and R5=10.5k, R6= 9.76k
R5 R3 R6 R4 5V REF 10F 5.2V 100nF 20 2.7nF 2.7nF 100nF 20 IN- GND REF IN+ VDD 2.5V
AD7982
Regardless, there is no need for an additional lower value ceramic decoupling capacitor (for example, 100 nF) between the REF and GND pins.
POWER SUPPLY
It uses two power supply pins: a core supply VDD and a digital input/output interface supply VIO. VIO allows direct interface with any logic between 1.8 V and VDD. To reduce the supplies needed, the VIO and VDD can be tied together. The AD7982 is independent of power supply sequencing between VIO and VDD. Additionally, it is very insensitive to power supply variations over a wide frequency range. To ensure optimum performance, VDD should be roughly half of REF, the voltage reference input. For example if REF is 5.0V, VDD should be set to 2.5V (+/-5%). The AD7982 powers down automatically at the end of each conversion phase and, therefore, the power scales linearly with the sampling rate. This makes the part ideal for low sampling rate (even a few Hz) and low battery-powered applications.
AD7982
ADA4941 10V, 5V, ..
-0.2V R1 R2 CF
Figure 15. Single-Ended-to-Differential Driver Circuit
VOLTAGE REFERENCE INPUT
The AD7982 voltage reference input, REF, has a dynamic, input impedance and should therefore be driven by a low impedance source with efficient decoupling between the REF and GND pins, as explained in the Layout section. When REF is driven by a very low impedance source, for example, a reference buffer using the AD8031 or the AD8605, a 10 F (X5R, 0805 size) ceramic chip capacitor is appropriate for optimum performance. If an unbuffered reference voltage is used, the decoupling value depends on the reference used. For instance, a 22 F (X5R, 1206 size) ceramic chip capacitor is appropriate for optimum performance using a low temperature drift ADR43x reference. If desired, smaller reference decoupling capacitor values down to 2.2 F can be used with a minimal impact on performance, especially DNL.
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AD7982
DIGITAL INTERFACE
Though the AD7982 has a reduced number of pins, it offers flexibility in its serial interface modes. The AD7982, when in CS mode, is compatible with SPI, QSPI, digital hosts, and DSPs, e.g., Blackfin(R) ADSP-BF53x or ADSP219x. This interface can use either 3-wire or 4-wire. A 3-wire interface using the CNV, SCK, and SDO signals minimizes wiring connections useful, for instance, in isolated applications. A 4-wire interface using the SDI, CNV, SCK, and SDO signals allows CNV, which initiates the conversions, to be independent of the readback timing (SDI). This is useful in low jitter sampling or simultaneous sampling applications. The AD7982, when in chain mode, provides a daisy chain feature using the SDI input for cascading multiple ADCs on a single data line similar to a shift register. The mode in which the part operates depends on the SDI level when the CNV rising edge occurs. The CS mode is selected if SDI is high and the chain mode is selected if SDI is low. The SDI hold time is such that when SDI and CNV are connected together, the chain mode is always selected. In either mode, the AD7982 offers the flexibility to optionally force a start bit in front of the data bits. This start bit can be used as a BUSY signal indicator to interrupt the digital host and trigger the data reading. Otherwise, without a BUSY indicator, the user must time out the maximum conversion time prior to readback. The BUSY indicator feature is enabled as: * In the CS mode, if CNV or SDI is low when the ADC conversion ends (Figure 19 and Figure 23). * In the chain mode, if SCK is high during the CNV rising edge (Figure 27).
Preliminary Technical Data
Rev PrC | Page 14 of 23
Preliminary Technical Data
CS MODE 3-WIRE, NO BUSY INDICATOR
This mode is usually used when a single AD7982 is connected to an SPI compatible digital host. The connection diagram is shown in Figure 16 and the corresponding timing is given in Figure 17. With SDI tied to VIO, a rising edge on CNV initiates a conversion, selects the CS mode, and forces SDO to high impedance. Once a conversion is initiated, it will continue to completion irrespective of the state of CNV. For instance, it could be useful to bring CNV low to select other SPI devices, such as analog multiplexers, but CNV must be returned high before the minimum conversion time and held high until the maximum conversion time to avoid the generation of the BUSY signal indicator. When the conversion is complete, the AD7982 enters the acquisition phase and powers down. When CNV goes low, the MSB is output onto SDO. The remaining data bits are then clocked by subsequent SCK falling edges. The data is valid on both SCK edges. Although the rising edge can be used
AD7982
to capture the data, a digital host using the SCK falling edge will allow a faster reading rate provided it has an acceptable hold time. After the 18th SCK falling edge or when CNV goes high, whichever is earlier, SDO returns to high impedance.
CONVERT CNV VIO SDI DIGITAL HOST SDO DATA IN
AD7982
SCK
CLK
Figure 16. CS Mode 3-Wire, No BUSY Indicator Connection Diagram (SDI High)
SDI = 1
tCYC tCNVH
CNV
tCONV
ACQUISITION CONVERSION
tACQ
ACQUISITION
tSCK tSCKL
SCK 1 2 3 16 17 18
tHSDO tEN
SDO D17 D16
tSCKH tDSDO
D15 D1 D0
tDIS
05792-012
Figure 17. CS Mode 3-Wire, No BUSY Indicator Serial Interface Timing (SDI High)
Rev PrC | Page 15 of 23
AD7982
CS MODE 3-WIRE WITH BUSY INDICATOR
This mode is usually used when a single AD7982 is connected to an SPI compatible digital host having an interrupt input. The connection diagram is shown in Figure 18 and the corresponding timing is given in Figure 19. With SDI tied to VIO, a rising edge on CNV initiates a conversion, selects the CS mode, and forces SDO to high impedance. SDO is maintained in high impedance until the completion of the conversion irrespective of the state of CNV. Prior to the minimum conversion time, CNV could be used to select other SPI devices, such as analog multiplexers, but CNV must be returned low before the minimum conversion time and held low until the maximum conversion time to guarantee the generation of the BUSY signal indicator. When the conversion is complete, SDO goes from high impedance to low. With a pull-up on the SDO line, this transition can be used as an interrupt signal to initiate the data reading controlled by the digital host. The AD7982 then enters the acquisition phase and powers down. The data bits are then clocked out, MSB first, by subsequent SCK falling edges. The data is valid on both SCK
Preliminary Technical Data
edges. Although the rising edge can be used to capture the data, a digital host using the SCK falling edge will allow a faster reading rate provided it has an acceptable hold time. After the optional 19th SCK falling edge, or when CNV goes high, whichever is earlier, SDO returns to high impedance. If multiple AD7982s are selected at the same time, the SDO output pin handles this contention without damage or induced latch-up. Meanwhile, it is recommended to keep this contention as short as possible to limit extra power dissipation.
CONVERT CNV VIO SDI VIO 47k DIGITAL HOST DATA IN IRQ CLK
AD7982
SCK
SDO
Figure 18. CS Mode 3-Wire with BUSY Indicator Connection Diagram (SDI High)
SDI = 1
tCYC tCNVH
CNV
tCONV
ACQUISITION CONVERSION
tACQ
ACQUISITION
tSCK tSCKL
SCK 1 2 3 17 18 19
tHSDO tDSDO
SDO D17 D16
tSCKH tDIS
D1 D0
05792-014
Figure 19. CS Mode 3-Wire with BUSY Indicator Serial Interface Timing (SDI High)
Rev PrC | Page 16 of 23
Preliminary Technical Data
CS Mode 4-Wire, No BUSY Indicator
This mode is usually used when multiple AD7982s are connected to an SPI compatible digital host. A connection diagram example using two AD7982s is shown in Figure 20 and the corresponding timing is given in Figure 21. With SDI high, a rising edge on CNV initiates a conversion, selects the CS mode, and forces SDO to high impedance. In this mode, CNV must be held high during the conversion phase and the subsequent data readback (if SDI and CNV are low, SDO is driven low). Prior to the minimum conversion time, SDI could be used to select other SPI devices, such as analog multiplexers, but SDI must be returned high before the minimum conversion
AD7982
time and held high until the maximum conversion time to avoid the generation of the BUSY signal indicator. When the conversion is complete, the AD7982 enters the acquisition phase and powers down. Each ADC result can be read by bringing low its SDI input which consequently outputs the MSB onto SDO. The remaining data bits are then clocked by subsequent SCK falling edges. The data is valid on both SCK edges. Although the rising edge can be used to capture the data, a digital host using the SCK falling edge will allow a faster reading rate provided it has an acceptable hold time. After the 18th SCK falling edge, or when SDI goes high, whichever is earlier, SDO returns to high impedance and another AD7982 can be read.
CS2 CS1 CONVERT CNV SDI CNV SDO SDI DIGITAL HOST SDO
AD7982
SCK
AD7982
SCK
DATA IN CLK
Figure 20. CS Mode 4-Wire, No BUSY Indicator Connection Diagram
tCYC
CNV
tCONV
ACQUISITION CONVERSION
tACQ
ACQUISITION
tSSDICNV
SDI(CS1)
tHSDICNV
SDI(CS2)
tSCK tSCKL
SCK 1 2 3 16 17 18 19 20 34 35 36
tHSDO tEN
SDO D17 D16
tSCKH tDSDO
D15 D1 D0 D17 D16 D1 D0
tDIS
05792-016
Figure 21. CS Mode 4-Wire, No BUSY Indicator Serial Interface Timing
Rev PrC | Page 17 of 23
AD7982
CS MODE 4-WIRE WITH BUSY INDICATOR
This mode is usually used when a single AD7982 is connected to an SPI compatible digital host, which has an interrupt input, and it is desired to keep CNV, which is used to sample the analog input, independent of the signal used to select the data reading. This requirement is particularly important in applications where low jitter on CNV is desired. The connection diagram is shown in Figure 22 and the corresponding timing is given in Figure 23. With SDI high, a rising edge on CNV initiates a conversion, selects the CS mode, and forces SDO to high impedance. In this mode, CNV must be held high during the conversion phase and the subsequent data readback (if SDI and CNV are low, SDO is driven low). Prior to the minimum conversion time, SDI could be used to select other SPI devices, such as analog multiplexers, but SDI must be returned low before the minimum conversion time and held low until the maximum conversion time to guarantee the generation of the BUSY signal indicator. When the conversion is complete, SDO goes from high impedance to low. With a pull-up on the SDO line, this transition can be used as an interrupt signal to initiate the data readback controlled by
CNV SDI
Preliminary Technical Data
the digital host. The AD7982 then enters the acquisition phase and powers down. The data bits are then clocked out, MSB first, by subsequent SCK falling edges. The data is valid on both SCK edges. Although the rising edge can be used to capture the data, a digital host using the SCK falling edge will allow a faster reading rate provided it has an acceptable hold time. After the optional 19th SCK falling edge, or SDI going high, whichever is earlier, the SDO returns to high impedance.
CS1 CONVERT VIO 47k DIGITAL HOST DATA IN IRQ CLK
AD7982
SCK
SDO
Figure 22. CS Mode 4-Wire with BUSY Indicator Connection Diagram
tCYC
CNV
tCONV
ACQUISITION CONVERSION
tACQ
ACQUISITION
tSSDICNV
SDI
tHSDICNV tSCKL
SCK 1 2 3 17
tSCK
18
19
tHSDO tDSDO tEN
SDO D17 D16
tSCKH tDIS
D1 D0
05792-018
Figure 23. CS Mode 4-Wire with BUSY Indicator Serial Interface Timing
Rev PrC | Page 18 of 23
Preliminary Technical Data
CHAIN MODE, NO BUSY INDICATOR
This mode can be used to daisy chain multiple AD7982s on a 3wire serial interface. This feature is useful for reducing component count and wiring connections, e.g., in isolated multiconverter applications or for systems with a limited interfacing capacity. Data readback is analogous to clocking a shift register. A connection diagram example using two AD7982s is shown in Figure 24 and the corresponding timing is given in Figure 25. When SDI and CNV are low, SDO is driven low. With SCK low, a rising edge on CNV initiates a conversion, selects the chain mode, and disables the BUSY indicator. In this mode, CNV is held high during the conversion phase and the subsequent data
AD7982
readback. When the conversion is complete, the MSB is output onto SDO and the AD7982 enters the acquisition phase and powers down. The remaining data bits stored in the internal shift register are then clocked by subsequent SCK falling edges. For each ADC, SDI feeds the input of the internal shift register and is clocked by the SCK falling edge. Each ADC in the chain outputs its data MSB first, and 18 x N clocks are required to readback the N ADCs. The data is valid on both SCK edges. Although the rising edge can be used to capture the data, a digital host using the SCK falling edge will allow a faster reading rate and, consequently more AD7982s in the chain, provided the digital host has an acceptable hold time. The maximum conversion rate may be reduced due to the total readback time.
CONVERT CNV SDI CNV SDO SDI DIGITAL HOST SDO DATA IN
AD7982
A SCK
AD7982
B SCK
CLK
Figure 24. Chain Mode, No BUSY Indicator Connection Diagram
SDIA = 0
tCYC
CNV
tCONV
ACQUISITION CONVERSION
tACQ
ACQUISITION
tSCK tSSCKCNV
SCK 1 2 3
tSCKL
16 17 18 19 20 34 35 36
tHSCKCNV tEN
SDOA = SDIB
tSSDISCK tHSDISC
DA17 DA16 DA15 DA1
tSCKH
DA 0
tHSDO tDSDO
SDOB DB17 DB16 DB15 DB1 DB 0 DA17 DA16 DA1 DA0
05792-020
Figure 25. Chain Mode, No BUSY Indicator Serial Interface Timing
Rev PrC | Page 19 of 23
AD7982
CHAIN MODE WITH BUSY INDICATOR
This mode can also be used to daisy chain multiple AD7982s on a 3-wire serial interface while providing a BUSY indicator. This feature is useful for reducing component count and wiring connections, e.g., in isolated multiconverter applications or for systems with a limited interfacing capacity. Data readback is analogous to clocking a shift register. A connection diagram example using three AD7982s is shown in Figure 26 and the corresponding timing is given in Figure 27. When SDI and CNV are low, SDO is driven low. With SCK high, a rising edge on CNV initiates a conversion, selects the chain mode, and enables the BUSY indicator feature. In this mode, CNV is held high during the conversion phase and the
Preliminary Technical Data
subsequent data readback. When all ADCs in the chain have completed their conversions, the nearend ADC ( ADC C in Figure 26) SDO is driven high. This transition on SDO can be used as a BUSY indicator to trigger the data readback controlled by the digital host. The AD7982 then enters the acquisition phase and powers down. The data bits stored in the internal shift register are then clocked out, MSB first, by subsequent SCK falling edges. For each ADC, SDI feeds the input of the internal shift register and is clocked by the SCK falling edge. Each ADC in the chain outputs its data MSB first, and 18 x N + 1 clocks are required to readback the N ADCs. Although the rising edge can be used to capture the data, a digital host using the SCK falling edge allows a faster reading rate and, consequently more AD7982s in the chain, provided the digital host has an acceptable hold time.
CONVERT CNV SDI CNV SDO SDI CNV SDO SDI DIGITAL HOST SDO DATA IN IRQ CLK
AD7982
A SCK
AD7982
B SCK
AD7982
C SCK
Figure 26. Chain Mode with BUSY Indicator Connection Diagram
tCYC
CNV = SDIA
tCONV
CONVERSION
tACQ
ACQUISITION
ACQUISITION
tSSCKCNV
SCK 1 2 3
tSCKH
4
tSCK
17 18 19 20 21 35 36 37 38 39 53 54 55
tHSCKCNV tEN
SDOA = SDIB
tSSDISCK
tHSDISC
DA1
tSCKL
DA0
tDSDOSDI
DA17 DA16 DA15
tHSDO tDSDO
SDOB = SDIC
tDSDOSDI
DB17 DB16 DB15 DB1 DB0 DA17 DA16 DA1 DA0
05792-022
tDSDOSDI tDSDOSDI
tDSDOSDI
DC17 DC16 DC15 D C1 DC0 DB17 DB16 DB1 DB0 DA17 DA16 DA1 DA0
SDOC
Figure 27. Chain Mode with BUSY Indicator Serial Interface Timing
Rev PrC | Page 20 of 23
Preliminary Technical Data APPLICATION HINTS
LAYOUT
The printed circuit board that houses the AD7982 should be designed so that the analog and digital sections are separated and confined to certain areas of the board. The pinout of the AD7982, with all its analog signals on the left side and all its digital signals on the right side, eases this task. Avoid running digital lines under the device because these couple noise onto the die, unless a ground plane under the AD7982 is used as a shield. Fast switching signals, such as CNV or clocks, should never run near analog signal paths. Crossover of digital and analog signals should be avoided At least one ground plane should be used. It could be common or split between the digital and analog section. In the latter case, the planes should be joined underneath the AD7982s. The AD7982 voltage reference input REF has a dynamic, input impedance and should be decoupled with minimal parasitic inductances. This is done by placing the reference decoupling ceramic capacitor close to, and ideally right up against, the REF and GND pins and connected with wide, low impedance traces. Finally, the power supplies VDD and VIO of the AD7982 should be decoupled with ceramic capacitors, typically 100 nF, placed close to the AD7982 and connected using short and wide traces to provide low impedance paths and reduce the effect of glitches on the power supply lines. An example of layout following these rules is shown in Figure 28 and Figure 29.
AD7982
AD7982
Figure 28. Example of Layout of the AD7982 (Top Layer)
EVALUATING THE AD7982'S PERFORMANCE
Other recommended layouts for the AD7982 are outlined in the documentation of the evaluation board for the AD7982 (EVAL-AD7982-CB). The evaluation board package includes a fully assembled and tested evaluation board, documentation, and software for controlling the board from a PC via the EVAL-CONTROL BRD3.
Figure 29. Example of Layout of the AD7982 (Bottom Layer)
Rev PrC | Page 21 of 23
AD7982 OUTLINE DIMENSIONS
3.00 BSC
Preliminary Technical Data
10
6
3.00 BSC
1 5
4.90 BSC
PIN 1 0.50 BSC 0.95 0.85 0.75 0.15 0.00 0.27 0.17 COPLANARITY 0.10 COMPLIANT TO JEDEC STANDARDS MO-187-BA 1.10 MAX 8 0 0.80 0.60 0.40
SEATING PLANE
0.23 0.08
Figure 30.10-Lead Mini Small Outline Package [MSOP] (RM-10) Dimensions shown in millimeters
INDEX AREA
3.00 BSC SQ
10
PIN 1 INDICATOR
1
1.50 BCS SQ
TOP VIEW
0.50 BSC
EXPOSED PAD
(BOTTOM VIEW)
2.48 2.38 2.23
5
6
0.80 0.75 0.70 SEATING PLANE
0.80 MAX 0.55 TYP
SIDE VIEW
0.50 0.40 0.30 0.05 MAX 0.02 NOM 0.20 REF
1.74 1.64 1.49
PADDLE CONNECTED TO GND. THIS CONNECTION IS NOT REQUIRED TO MEET THE ELECTRICAL PERFORMANCES
0.30 0.23 0.18
Figure 31. 10-Lead Lead Frame Chip Scale Package [QFN (LFCSP_WD)] 3 mm x 3 mm Body, Very Very Thin, Dual Lead (CP-10-9) Dimensions shown in millimeters
Rev PrC | Page 22 of 23
Preliminary Technical Data NOTES
AD7982
Rev PrC | Page 23 of 23
PR06513-0-11/06(PrC)

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